Description

Positioning of chips on printed-circuit boards is performed with the help of the ERSA PL550A precision placement system. Alignment of chip leads and termination pads is controlled on the PC screen. Soldering in the APIK-2 infrared fuser allows setting necessary thermal profiling for assembly of elements manufactured using both lead and lead-free technology.

The quality of soldered joints is controlled with the help of the ERSASCOPE-2, a programmable optical system which displays information on the PC screen and makes it possible to visually inspect the quality of the shape of fused leads as a result of soldering (shape, surface, meniscuses, coplanarity).

The proven technology for rework of chip ball pins in BGA packages (pin diameter is 0.5 ÷ 0.75 mm) provides their reuse which is economically attractive taking into account high cost and long terms of their supply.