Packaging of chip balls in ball grid array

Full description


Positioning of chips on printed-circuit boards is done with the help of the ERSA PL550A precision placement system. Alignment of chip leads and termination pads is controlled on the PC screen. Soldering in the APIK-2 infrared fuser allows setting necessary thermal profiling for packaging of elements manufactured using both lead and lead-free technology.


The quality of soldered joints is controlled with the help of the ERSASCOPE-2, a programmable optical system which displays information on the PC screen and makes it possible to visually inspect the quality of balls after soldering (shape, surface, meniscuses, coplanarity).

The proven technology for rework of chip balls in BGA packages (ball diameter is 0.5÷0.75 mm) provides for their reuse which is economically attractive considering their high cost.